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3M Thermal Bonding Film AF111 is an epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials (epoxy and phenolic).
This hot melt film adhesive may be cured at temperatures as low as 225 Degrees F. Provides excellent strength for either metal to melt or honeycomb sandwich applications. Releases no volatile by-products during cure thereby permitting low pressure bonding. Standard Lead Time: 30 Calendar Days
Features:
- Moderate tack
- Thick 10 mil caliper
- 250° F (121° C) cure
- High metal OLS and peel adhesion
- High flow
- 40° F (4° C) storage required
Product Specifications
| Manufacturer Part Number | 7000000819 |
| Overall Length (Inch) | 36.0 yd |
| Overall Length (mm) | 33.0m |
| Overall Width (Inch) | 40.0" |
| Overall Width (mm) | 1016.0mm |
| Curing Temperature (Celsius) | 121.0 Degree Celsius |
| Curing Temperature (Fahrenheit) | 250.0 Degree Fahrenheit |
| Maximum Operating Temperature (Celsius) | 0.0 NP |
| Maximum Operating Temperature (Fahrenheit) | 0.0 NP |
| Minimum Operating Temperature (Celsius) | 0.0 NP |
| Minimum Operating Temperature (Fahrenheit) | 0.0 NP |
Warning:
This product can expose you to materials and/or chemicals including arsenic, lead, and other materials and/or chemicals which are known to the state of California to cause cancer and/or reproductive harm.
For more information, visit www.P65Warnings.ca.gov
interval quantity:
1
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