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3M Thermal Bonding Film 583 is a high strength, flexible, nitrile phenolic based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.
This hot melt film adhesive provides a strong, permanent bond to the surface to which it is applied. The adhesive can be used for splicing of glass fabric during PCB board manufacturing. Can be solvent activated in the uncured form.
Features:
- Flexible
- Heat or solvent activation
- Can be die-cut
- Slight surface tack
- Heat crosslinkable option
- Lower temperature lamination of the nitrile phenolic film range
Product Specifications
| Manufacturer Part Number | 7000047511 |
| Overall Length (Inch) | 60.0 yd |
| Overall Length (mm) | 54.9m |
| Overall Thickness (mm) | 5.0mm |
| Overall Width (Inch) | 3.0" |
| Overall Width (mm) | 76.2mm |
| Color Family | Brown |
| Curing Temperature (Celsius) | 107.0 Degree Celsius |
| Curing Temperature (Fahrenheit) | 225.0 Degree Fahrenheit |
| Maximum Operating Temperature (Celsius) | 150.0 Degree Celsius |
| Maximum Operating Temperature (Fahrenheit) | 300.0 Degree Fahrenheit |
| Minimum Operating Temperature (Celsius) | 0.0 NP |
| Minimum Operating Temperature (Fahrenheit) | 0.0 NP |
| Product Color | Brown |
| Shear Strength | 14.0 psi |
Warning:
This product can expose you to materials and/or chemicals including arsenic, lead, and other materials and/or chemicals which are known to the state of California to cause cancer and/or reproductive harm.
For more information, visit www.P65Warnings.ca.gov
interval quantity:
12
Ships:
From Manufacturer ***Temporary Supply Disruption***
