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3M Thermal Bonding Film 588 is a high strength, flexible, nitrile phenolic-based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.
3M Thermal Bonding Film 588 is a thicker version of the 3M Thermal Bonding Film 583. This hot melt film adhesive can be used for splicing of glass fabric during PCB board manufacturing. Can be solvent activated in the uncured form and is a heat curing film. Standard Lead Time: 30 Calendar Days
Features:
- Flexible
- Heat or solvent activation
- Can be die-cut
- Heat crosslinkable option
| Manufacturer Part Number | 7000048414 |
| Overall Length (Inch) | 60.0 yd |
| Overall Length (mm) | 54.9m |
| Overall Width (Inch) | 1.25" |
| Overall Width (mm) | 31.8mm |
| Color Family | Yellow |
| Curing Temperature (Celsius) | 107.0 Degree Celsius |
| Curing Temperature (Fahrenheit) | 225.0 Degree Fahrenheit |
| Maximum Operating Temperature (Celsius) | 150.0 Degree Celsius |
| Maximum Operating Temperature (Fahrenheit) | 300.0 Degree Fahrenheit |
| Minimum Operating Temperature (Celsius) | 0.0 NP |
| Minimum Operating Temperature (Fahrenheit) | 0.0 NP |
| Shear Strength | 24.9 psi |
Warning:
This product can expose you to materials and/or chemicals including arsenic, lead, and other materials and/or chemicals which are known to the state of California to cause cancer and/or reproductive harm.
For more information, visit www.P65Warnings.ca.gov
