3M Thermal Bonding Film AF111 is an epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials (epoxy and phenolic).
This hot melt film adhesive may be cured at temperatures as low as 225 Degrees F. Provides excellent strength for either metal to melt or honeycomb sandwich applications. Releases no volatile by-products during cure thereby permitting low pressure bonding. Standard Lead Time: 30 Calendar Days
Features:
| Manufacturer Part Number | 7000000819 |
| Overall Length (Inch) | 36.0 yd |
| Overall Length (mm) | 33.0m |
| Overall Width (Inch) | 40.0" |
| Overall Width (mm) | 1016.0mm |
| Curing Temperature (Celsius) | 121.0 Degree Celsius |
| Curing Temperature (Fahrenheit) | 250.0 Degree Fahrenheit |
| Maximum Operating Temperature (Celsius) | 0.0 NP |
| Maximum Operating Temperature (Fahrenheit) | 0.0 NP |
| Minimum Operating Temperature (Celsius) | 0.0 NP |
| Minimum Operating Temperature (Fahrenheit) | 0.0 NP |
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